The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 26, 2022
Filed:
Jan. 21, 2019
Applicant:
Sanmina Corporation, San Jose, CA (US);
Inventors:
Douglas Ward Thomas, Pacific Grove, CA (US);
Shinichi Iketani, Sunnyvale, CA (US);
Dale Kersten, Ben Lomond, CA (US);
Assignee:
SANMINA CORPORATION, San Jose, CA (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/42 (2006.01); H05K 1/02 (2006.01); H05K 3/24 (2006.01);
U.S. Cl.
CPC ...
H05K 3/429 (2013.01); H05K 1/0216 (2013.01); H05K 3/24 (2013.01); H05K 2201/09845 (2013.01); H05K 2203/0207 (2013.01); H05K 2203/0242 (2013.01); H05K 2203/072 (2013.01); H05K 2203/0723 (2013.01);
Abstract
The present invention relates to printed circuit boards (PCBs), and more particularly, to methods of forming high aspect ratio through holes and high precision stub removal in a printed circuit board (PCB). The high precision stub removal processes may be utilized in removing long stubs and short stubs. In the methods, multiple holes of varying diameter and depth are drilled from an upper and/or lower surface of the printed circuit board utilizing drills of different diameters.