The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 26, 2022

Filed:

May. 07, 2020
Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventors:

Tetsuichiro Kasahara, Nagano, JP;

Tsukasa Nakanishi, Nagano, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 25/16 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); H01L 23/5383 (2013.01); H01L 25/16 (2013.01); H01L 21/4857 (2013.01);
Abstract

A wiring substrate includes a resin layer formed of an insulating resin, a first component, at least a part of which is embedded in the resin layer, a first wiring embedded in the resin layer, the first wiring including an exposed surface exposed from the resin layer at a first surface-side of the resin layer, and a first electrode including a wiring portion and an electrode portion, the wiring portion embedded in the resin layer and connecting to the first component in the resin layer, the electrode portion protruding from the first surface-side of the resin layer to a position higher than the exposed surface of the first wiring.


Find Patent Forward Citations

Loading…