The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 26, 2022
Filed:
Sep. 22, 2020
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Yann Mignot, Slingerlands, NY (US);
Yongan Xu, San Jose, CA (US);
Hsueh-Chung Chen, Cohoes, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/3213 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76883 (2013.01); H01L 21/32139 (2013.01); H01L 21/76832 (2013.01); H01L 21/76885 (2013.01);
Abstract
A method of forming a BEOL interconnect structure having improved resistance-capacitance is provided in which a via metal layer is created by a first metallization process and thereafter shrunk by a subtractive etch; these steps relax the critical dimension, ensure a via straight profile, avoid via chamfering and bowing, and maximize metal volume. Top trench metallization is then performed above the via metal layer; this step eliminates reactive ion etch lag and ensures no metallization void issues.