The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2022
Filed:
Oct. 25, 2018
Intel Corporation, Santa Clara, CA (US);
Albert Sutono, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
In accordance with embodiments disclosed herein, there is provided a high-density dual-embedded-microstrip interconnect. An interconnect includes a reference layer and a dielectric disposed on the reference layer. The interconnect further includes a pair of conductors including a first conductor and a second conductor that are in an edge-facing orientation. The interconnect further includes a third conductor. The pair of conductors may be disposed within the dielectric and the third conductor may be disposed on the dielectric above the pair of conductors. The pair of conductors may be disposed on the dielectric and the third conductor may be disposed within the dielectric below the pair of conductors. First noise received by the third conductor from the first conductor and second noise received by the third conductor from the second conductor at least partially cancel out.