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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11395373 B1

PDFFull Text
Date of Patent:
Jul. 19, 2022

Filed:

Dec. 17, 2018

Wafer holder with tapered region

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Yi-Hung Lin, Taipei, TW;

Li-Ting Wang, Hsinchu, TW;

Tze-Liang Lee, Hsinchu, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsin-Chu, TW;

Attorney:

Haynes and Boone, LLP

Primary Examiner:

Dana Ross

Assistant Examiner:

Joseph W Iskra

Int. Cl.
CPC ...
H05B 1/02 (2006.01); H01L 21/683 (2006.01); H01L 21/477 (2006.01); H01L 21/306 (2006.01); H01L 21/673 (2006.01); F27B 17/00 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); F27D 5/00 (2006.01);
U.S. Cl.
CPC ...
H05B 1/0233 (2013.01); F27B 17/0025 (2013.01); F27D 5/0037 (2013.01); H01L 21/306 (2013.01); H01L 21/477 (2013.01); H01L 21/67115 (2013.01); H01L 21/67303 (2013.01); H01L 21/683 (2013.01); H01L 21/68735 (2013.01); H01L 21/68757 (2013.01);
Abstract

An apparatus, a system and a method are disclosed. An exemplary method includes providing a wafer process chamber and a plurality of radiant heat elements under the wafer process chamber, receiving a wafer holder configured to be used in the wafer process chamber, and processing a wafer located on the wafer holder in the wafer process chamber. The wafer holder includes: a wafer contact portion including an upper surface and a lower surface, an exterior portion including an upper surface and a lower surface, and a tapered region formed in the wafer contact portion.

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Lin, Yi-Hung. (2022). Wafer holder with tapered region (U.S. Patent No. 11395373). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11395373

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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