The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2022

Filed:

Dec. 02, 2020
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventor:

Ming Hsien Tsai, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 7/01 (2006.01); H01F 17/00 (2006.01); H01L 49/02 (2006.01); H01L 23/00 (2006.01); H01L 23/528 (2006.01); H03H 7/09 (2006.01); H01L 23/522 (2006.01); H03H 1/00 (2006.01);
U.S. Cl.
CPC ...
H03H 7/0115 (2013.01); H01L 23/528 (2013.01); H01L 23/5223 (2013.01); H01L 23/5227 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 28/10 (2013.01); H01L 28/40 (2013.01); H03H 7/09 (2013.01); H01F 2017/0026 (2013.01); H01L 23/5286 (2013.01); H01L 2224/13116 (2013.01); H03H 2001/0078 (2013.01); H03H 2001/0085 (2013.01); H03H 2007/013 (2013.01);
Abstract

A filter structure includes a capacitive device and an inductive device. The capacitive device includes a ground plane in a first metal layer of an integrated circuit (IC) package, a plate in a second metal layer of the IC package, and a dielectric layer between the ground plane and the plate. The inductive device includes first and second conductive paths in a third metal layer of the IC package, each of the first and second conductive paths is electrically connected to the plate and has a width w, the first and second conductive paths are separated by a spacing s, and a ratio s/w has a value ranging from 1 to 2.


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