The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2022

Filed:

Aug. 10, 2020
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

William J. Durand, Oakland, CA (US);

Mark Saly, Santa Clara, CA (US);

Lakmal C. Kalutarage, San Jose, CA (US);

Kang Sub Yim, Palo Alto, CA (US);

Shaunak Mukherjee, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C23C 16/24 (2006.01); H01L 21/3205 (2006.01); H01L 21/683 (2006.01); C23C 16/50 (2006.01); C23C 16/34 (2006.01); C23C 16/32 (2006.01); C23C 16/40 (2006.01); C23C 16/36 (2006.01); C23C 16/30 (2006.01); H01L 27/11582 (2017.01); H01L 27/11556 (2017.01);
U.S. Cl.
CPC ...
H01L 21/02211 (2013.01); C23C 16/24 (2013.01); C23C 16/308 (2013.01); C23C 16/325 (2013.01); C23C 16/345 (2013.01); C23C 16/36 (2013.01); C23C 16/401 (2013.01); C23C 16/50 (2013.01); H01L 21/022 (2013.01); H01L 21/0214 (2013.01); H01L 21/0217 (2013.01); H01L 21/02126 (2013.01); H01L 21/02164 (2013.01); H01L 21/02167 (2013.01); H01L 21/02274 (2013.01); H01L 21/32051 (2013.01); H01L 21/32055 (2013.01); H01L 21/6831 (2013.01); H01L 27/11556 (2013.01); H01L 27/11582 (2013.01);
Abstract

Methods for deposition of high-hardness low-κ dielectric films are described. More particularly, a method of processing a substrate is provided. The method includes flowing a precursor-containing gas mixture into a processing volume of a processing chamber having a substrate, the precursor having the general formula (I) wherein R, R, R, R, R, R, R, and Rare independently selected from hydrogen (H), alkyl, alkoxy, vinyl, silane, amine, or halide; maintaining the substrate at a pressure in a range of about 0.1 mTorr and about 10 Torr and at a temperature in a range of about 200° C. to about 500° C.; and generating a plasma at a substrate level to deposit a dielectric film on the substrate.


Find Patent Forward Citations

Loading…