The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2022

Filed:

Oct. 19, 2017
Applicant:

Shengyi Technology Co., Ltd., Guangdong, CN;

Inventors:

Chiji Guan, Guangdong, CN;

Xianping Zeng, Guangdong, CN;

Guangbing Chen, Guangdong, CN;

Haosheng Xu, Guangdong, CN;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08L 25/08 (2006.01); C08J 5/24 (2006.01); C08L 83/04 (2006.01); C09D 183/04 (2006.01); H05K 1/02 (2006.01); C09D 125/08 (2006.01); B32B 5/02 (2006.01); B32B 5/26 (2006.01); H05K 1/03 (2006.01); C08G 77/00 (2006.01);
U.S. Cl.
CPC ...
C08L 25/08 (2013.01); B32B 5/022 (2013.01); B32B 5/024 (2013.01); B32B 5/26 (2013.01); C08J 5/24 (2013.01); C08L 83/04 (2013.01); C09D 125/08 (2013.01); C09D 183/04 (2013.01); H05K 1/024 (2013.01); H05K 1/0366 (2013.01); B32B 2255/02 (2013.01); B32B 2255/205 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2307/204 (2013.01); B32B 2307/306 (2013.01); B32B 2307/558 (2013.01); B32B 2307/7265 (2013.01); B32B 2457/08 (2013.01); C08G 77/70 (2013.01); C08J 2325/08 (2013.01); C08J 2383/07 (2013.01); C08J 2425/08 (2013.01); C08J 2483/07 (2013.01); C08L 2201/08 (2013.01); H05K 2201/029 (2013.01); H05K 2201/0293 (2013.01);
Abstract

A thermosetting resin composition and a prepreg and a metal foil-covered laminate made using same, the thermosetting resin composition comprising component (A): a solvent-soluble polyfunctional vinyl aromatic copolymer, the copolymer being a poly-functional vinyl aromatic copolymer having a stoctoal unit derived from monomers comprising divinyl aromatic compound (a) and ethyl vinyl aromatic compound (b); and component (B): a vinyl-containing organic silicone resin. The prepreg and metal foil-covered laminate made from the thermosetting resin composition have good toughness, and maintain a high glass transition temperature, a low water absorption, dielectric properties and humidity resistance, being suitable for the field of high-frequency and high-speed printed circuit boards and the processing of multilayer printed circuit boards.


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