The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2022
Filed:
Jul. 13, 2020
Applicant:
Alpha Assembly Solutions Inc., Waterbury, CT (US);
Inventors:
Oscar Khaselev, Monmouth Junction, NJ (US);
Bin Mo, East Brunswick, NJ (US);
Monnir Boureghda, East Stroudsburg, PA (US);
Michael T. Marczi, Chester, NJ (US);
Bawa Singh, Marlton, NJ (US);
Assignee:
ALPHA ASSEMBLY SOLUTIONS INC., Waterbury, CT (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/04 (2006.01); B32B 15/01 (2006.01); B22F 5/00 (2006.01); B22F 7/04 (2006.01); C22C 32/00 (2006.01); C22C 49/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
B32B 15/018 (2013.01); B22F 5/006 (2013.01); B22F 7/04 (2013.01); B32B 15/01 (2013.01); C22C 32/00 (2013.01); C22C 49/00 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2224/29083 (2013.01); H01L 2224/8384 (2013.01); Y10T 428/12056 (2015.01); Y10T 428/12063 (2015.01); Y10T 428/12069 (2015.01); Y10T 428/12076 (2015.01); Y10T 428/12139 (2015.01);
Abstract
A silver film for die attachment in the field of microelectronics, wherein the silver film is a multilayer structure comprising a reinforcing silver foil layer between two layers of sinterable particles. Each layer of sinterable particles comprises a mixture of sinterable silver particles and reinforcing particles. The reinforcing particles comprise glass and/or carbon and/or graphite particles. A method for die attachment using a silver film.