The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2022
Filed:
May. 06, 2019
The Regents of the University of California, Oakland, CA (US);
National Chiao Tung University, Hsinchu, TW;
Wentai Liu, Los Angeles, CA (US);
Chih-Wei Chang, Los Angeles, CA (US);
Pu-Wei Wu, Chu-Bei, TW;
Chung-Yu Wu, Hsin-Chu County, TW;
Po-Chun Chen, Tapei, TW;
Tsai-Wei Chung, Tou-Fen, TW;
THE REGENTS OF THE UNIVERSITY OF CALIFORNIA, Oakland, CA (US);
NATIONAL CHIAO TUNG UNIVERSITY, Hsinchu, TW;
Abstract
A flexible thin film metal oxide electrode fabrication methods and devices are provided and illustrated with thin film polyimide electrode formation and IrOx chemical bath deposition. Growth factors of the deposited film such as film thickness, deposition rate and quality of crystallites can be controlled by varying the solution pH, temperature and component concentrations of the bath. The methods allow for selective deposition of IrOx on a flexible substrate (e.g. polyimide electrode) where the IrOx will only coat onto an exposed metal area but not the entire device surface. This feature enables the bath process to coat the IrOx onto every individual electrode in one batch, and to ensure electrical isolation between channels. The ability to perform selective deposition, pads for external connections will not have IrOx coverage that would otherwise interfere with a soldering/bumping process.