The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2022
Filed:
Oct. 05, 2018
Applicant:
At&s Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;
Inventors:
Marco Gavagnin, Leoben, AT;
Markus Leitgeb, Trofaiach, AT;
Jonathan Silvano de Sousa, Vienna, AT;
Ferdinand Lutschounig, Ferlach, AT;
Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/46 (2006.01); H05K 3/10 (2006.01); H05K 3/36 (2006.01); H05K 1/02 (2006.01); B29C 64/10 (2017.01); B33Y 99/00 (2015.01); H05K 3/12 (2006.01); B33Y 80/00 (2015.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01);
U.S. Cl.
CPC ...
H05K 3/4664 (2013.01); B29C 64/10 (2017.08); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); B33Y 99/00 (2014.12); H05K 1/0209 (2013.01); H05K 1/115 (2013.01); H05K 1/119 (2013.01); H05K 3/108 (2013.01); H05K 3/1241 (2013.01); H05K 3/368 (2013.01); H05K 3/4647 (2013.01); H05K 3/4682 (2013.01); B33Y 70/00 (2014.12); H05K 1/09 (2013.01); H05K 1/092 (2013.01); H05K 1/11 (2013.01); H05K 1/111 (2013.01); H05K 1/112 (2013.01); H05K 1/181 (2013.01); H05K 1/185 (2013.01); H05K 2201/0323 (2013.01); H05K 2201/0338 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1131 (2013.01);
Abstract
A component carrier and a method for manufacturing a component carrier is described wherein the component carrier includes a carrier body with a plurality of electrically conductive layer structures and/or electrically insulating layer structures and a wiring structure on and/or in the layer structures where the wiring structure is at least partially formed as a three-dimensionally printed structure.