The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2022
Filed:
Aug. 28, 2020
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Tapash Chakraborty, Maharashtra, IN;
Steven Verhaverbeke, San Francisco, CA (US);
Han-Wen Chen, Cupertino, CA (US);
Chintan Buch, Santa Clara, CA (US);
Prerna Goradia, Mumbai, IN;
Giback Park, Santa Clara, CA (US);
Kyuil Cho, Santa Clara, CA (US);
Assignee:
Applied Materials, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/06 (2006.01); H05K 3/28 (2006.01); H05K 3/46 (2006.01); H05K 3/38 (2006.01); B32B 15/08 (2006.01); B32B 7/12 (2006.01);
U.S. Cl.
CPC ...
H05K 3/386 (2013.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); H05K 3/0061 (2013.01); B32B 2457/08 (2013.01); H05K 2203/06 (2013.01);
Abstract
Methods for forming circuit boards and circuit boards using an adhesion layer are described. A substrate with two surfaces is exposed to a bifunctional organic compound to form an adhesion layer on the first substrate surface. A resin layer is then deposited on the adhesion layer and the exposed substrate surfaces. Portions of the resin layer may be removed to expose metal pads for contacts.