The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2022

Filed:

Apr. 24, 2020
Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventor:

Takehiro Ueda, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/417 (2006.01); C23C 18/16 (2006.01); H01L 21/288 (2006.01);
U.S. Cl.
CPC ...
H01L 29/41725 (2013.01); C23C 18/1642 (2013.01); H01L 21/288 (2013.01);
Abstract

The semiconductor device includes a first electrode, a second electrode electrically coupled to the first electrode, and a third electrodes electrically coupled to at least one of the first and the second electrode, a first plating deposition portion on the first electrode, a second and a third plating deposition portions formed on the second and the third electrode, respectively. The areas of the second and the third plating deposition portion are smaller than the area of the first plating deposition portion. The periphery length of the third plating deposition portion is longer than the periphery length of the second plating deposition portion.


Find Patent Forward Citations

Ueda, Takehiro. (2022). Semiconductor device with electrode plating deposition (U.S. Patent No. 11387334). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11387334

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…