The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2022

Filed:

May. 12, 2020
Applicant:

Stmicroelectronics (Rousset) Sas, Rousset, FR;

Inventors:

Alexandre Sarafianos, Pourrieres, FR;

Fabrice Marinet, Chateauneuf le Rouge, FR;

Julien Delalleau, Marseilles, FR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); G06F 21/55 (2013.01);
U.S. Cl.
CPC ...
H01L 23/573 (2013.01); G06F 21/554 (2013.01); G06F 2221/034 (2013.01);
Abstract

A semiconductor substrate has a front face and a back face. A first contact and a second contact, spaced apart from each other, are located on the front face. An electrically conductive wafer is located on the back face. A detection circuit is configured to detect a thinning of the substrate from the back face. The detection circuit including a measurement circuit that takes a measurement of a resistive value of the substrate between said at least one first contact, said at least one second contact and said electrically conductive wafer. Thinning is detected in response to the measured resistive value.


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