The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2022
Filed:
Mar. 24, 2021
Disco Corporation, Tokyo, JP;
Masaru Nakamura, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
A wafer processing method includes a modified layer forming step, a protective member disposing step, a reinforcing portion forming step, and an undersurface processing step. The modified layer forming step forms, in a ring shape, a modified layer not reaching a finished thickness of a wafer by irradiating the wafer with a laser beam such that a condensing point of the laser beam is positioned in an inner part of the wafer, the inner part corresponding to a peripheral surplus region. The reinforcing portion forming step makes a cleavage plane reach the top surface from the modified layer formed in a ring shape, removes the modified layer, thins a region corresponding to a device region of the wafer to the finished thickness, and forms a ring-shaped reinforcing portion in a region corresponding to the peripheral surplus region of the wafer by grinding the undersurface of the wafer.