The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2022

Filed:

Aug. 13, 2020
Applicants:

Semiconductor Manufacturing International (Shanghai) Corporation, Shanghai, CN;

Semiconductor Manufacturing International (Beijing) Corporation, Beijing, CN;

Inventors:

Hui Ping Duan, Shanghai, CN;

Kun Peng, Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); G06F 21/73 (2013.01); G06F 21/60 (2013.01); H04L 9/08 (2006.01); G11C 13/00 (2006.01); G11C 11/417 (2006.01); H04L 9/32 (2006.01);
U.S. Cl.
CPC ...
G06F 21/73 (2013.01); G06F 21/604 (2013.01); G11C 11/417 (2013.01); G11C 13/0007 (2013.01); G11C 13/0069 (2013.01); H01L 23/57 (2013.01); H04L 9/0866 (2013.01); H04L 9/3278 (2013.01);
Abstract

A physical unclonable function (PUF) chip is provided. The physical unclonable function (PUF) chip includes a chip with a top metal connection layer, an array of spaced electrode plates on the top metal connection layer of the chip, a deposition layer, on the top metal connection layer between each two adjacent electrode plates. An opening is formed between the each two adjacent electrode plates in a row, and each two adjacent electrode plates are tangential to the opening formed between the two adjacent electrode plates. The physical unclonable function (PUF) chip further includes a conductive coating layer on the chip and the conductive coating layer includes conductive particles with randomly distributed size, and a package substrate, packaged with the chip including the conductive coating layer.


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