The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2022

Filed:

Jul. 20, 2020
Applicants:

Foxconn (Kunshan) Computer Connector Co., Ltd., Kunshan, CN;

Foxconn Interconnect Technology Limited, Grand Cayman, KY;

Inventor:

Shuo-Hsiu Hsu, New Taipei, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 12/71 (2011.01); H01R 12/57 (2011.01); H01R 13/24 (2006.01); H01R 4/02 (2006.01); H01R 13/428 (2006.01); H01R 12/91 (2011.01); H01R 12/73 (2011.01);
U.S. Cl.
CPC ...
H01R 12/716 (2013.01); H01R 12/57 (2013.01); H01R 13/2442 (2013.01); H01R 13/2478 (2013.01); H01R 4/02 (2013.01); H01R 4/024 (2013.01); H01R 12/712 (2013.01); H01R 12/714 (2013.01); H01R 12/73 (2013.01); H01R 12/91 (2013.01); H01R 13/245 (2013.01); H01R 13/2407 (2013.01); H01R 13/2414 (2013.01); H01R 13/2492 (2013.01); H01R 13/428 (2013.01);
Abstract

An electrical connector includes an insulative housing with a plurality of passageways extending through opposite upper and lower surfaces of the housing. A plurality of electrical contacts are received within the corresponding passageways, respectively. Each contact includes a first main body and a second main body side by side arranged with each other with a bridge transversely linked therebetween. At least one of the first main body and the second main body includes a retaining barb for retaining contact in the passageway. Two soldering pads are formed on the corresponding bottom ends of the first main body and the second main body, respectively. The two soldering pads intimately confront each other either in a horizontal direction or in a vertical direction, and are joined together via a solder ball located under the two soldering pads.


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