The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2022
Filed:
Mar. 29, 2018
Applicant:
Intel Ip Corporation, Santa Clara, CA (US);
Inventors:
Sidharth Dalmia, Portland, OR (US);
Jonathan Jensen, Portland, OR (US);
Ozgur Inac, Portland, OR (US);
Trang Thai, Hillsboro, OR (US);
William James Lambert, Chandler, AZ (US);
Benjamin Jann, Hillsboro, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/24 (2006.01); H01Q 9/04 (2006.01); H01Q 1/22 (2006.01); H01Q 1/38 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/243 (2013.01); H01Q 1/2283 (2013.01); H01Q 9/0414 (2013.01); H01L 23/66 (2013.01); H01L 2223/6677 (2013.01); H01L 2924/1421 (2013.01); H01Q 1/38 (2013.01);
Abstract
Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.