The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2022

Filed:

Sep. 16, 2020
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Ching-Chung Su, Tainan, TW;

Jiech-Fun Lu, Madou Township, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14638 (2013.01); H01L 27/1462 (2013.01); H01L 27/1463 (2013.01); H01L 27/14601 (2013.01); H01L 27/14605 (2013.01); H01L 27/14621 (2013.01); H01L 27/14625 (2013.01); H01L 27/14632 (2013.01); H01L 27/14636 (2013.01); H01L 27/14643 (2013.01); H01L 27/14645 (2013.01); H01L 27/14685 (2013.01); H01L 27/14687 (2013.01); H01L 27/14694 (2013.01); H01L 27/1464 (2013.01);
Abstract

Various embodiments of the present disclosure are directed towards a method for manufacturing a semiconductor structure. The method includes forming photodetectors within a semiconductor substrate. A charge release layer is deposited over the semiconductor substrate. A conductive contact is formed over the charge release layer such that a contact protrusion of the conductive contact extends through the charge release layer. The charge release layer is disposed along opposing sidewalls of the conductive contact. The charge release layer is electrically coupled to ground via the conductive contact.


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