The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2022
Filed:
Nov. 05, 2020
Shinko Electric Industries Co., Ltd., Nagano, JP;
Kengo Yamamoto, Nagano, JP;
Daisuke Ito, Nagano, JP;
Mitsuaki Okubo, Nagano, JP;
Kenji Uchida, Nagano, JP;
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Abstract
A copper pillar bump for an electrode pad of a semiconductor chip includes a first copper layer, a first metal layer formed directly on the first copper layer, a second copper layer formed directly on the first metal layer, and a second metal layer formed directly on the second copper layer, wherein the first metal layer and the second metal layer are made of a metal having a different etching rate than copper, wherein an outer perimeter ring of the first metal layer protrudes beyond a lateral surface of the first copper layer, and wherein an outer perimeter ring of the second metal layer protrudes beyond a lateral surface of the second copper layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile