The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2022

Filed:

Aug. 14, 2020
Applicant:

Asml Netherlands B.v., Veldhoven, NL;

Inventors:

Frank Gang Chen, Fremont, CA (US);

Joseph Werner De Vocht, Elk Grove, CA (US);

Yuelin Du, San Jose, CA (US);

Wanyu Li, Cupertino, CA (US);

Yen-Wen Lu, Saratoga, CA (US);

Assignee:

ASML Netherlands B.V., Veldhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 30/398 (2020.01); G03F 7/20 (2006.01);
U.S. Cl.
CPC ...
G06F 30/398 (2020.01); G03F 7/705 (2013.01); G03F 7/70508 (2013.01); G03F 7/70625 (2013.01); G03F 7/70641 (2013.01); G03F 7/70666 (2013.01);
Abstract

A method for determining an overlapping process window (OPW) of an area of interest on a portion of a design layout for a device manufacturing process for imaging the portion onto a substrate, the method including: obtaining a plurality of features in the area of interest; obtaining a plurality of values of one or more processing parameters of the device manufacturing process; determining existence of defects, probability of the existence of defects, or both in imaging the plurality of features by the device manufacturing process under each of the plurality of values; and determining the OPW of the area of interest from the existence of defects, the probability of the existence of defects, or both.


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