The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2022

Filed:

Dec. 09, 2019
Applicant:

Acer Incorporated, New Taipei, TW;

Inventors:

Yung-Chih Wang, New Taipei, TW;

Cheng-Wen Hsieh, New Taipei, TW;

Wen-Neng Liao, New Taipei, TW;

Assignee:

Acer Incorporated, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/20 (2006.01);
U.S. Cl.
CPC ...
G06F 1/203 (2013.01); G06F 2200/201 (2013.01);
Abstract

A heat dissipation module suitable for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator and a pipe assembly. An internal space of the evaporator is divided into a first space and a second space, and the heat source is thermally contacted with the second space. The pipe assembly is connected to the evaporator to form a loop. A working fluid is filled in the loop. The working fluid in liquid receiving heat from the heat source is transformed into vapor and flows to the pipe assembly. Then, the working fluid in vapor is transformed into liquid by dissipating heat in the pipe assembly and flows to the first space of the evaporator. The working fluid in liquid is stored in the first space and is used for supplying to the second space.


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