The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2022
Filed:
May. 15, 2020
Applicant:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
SENJU METAL INDUSTRY CO., LTD., Tokyo, JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C22C 13/02 (2006.01); B23K 35/26 (2006.01); B23K 1/00 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
C22C 13/02 (2013.01); B23K 1/0016 (2013.01); B23K 35/262 (2013.01); B23K 2101/42 (2018.08);
Abstract
Provided are a solder alloy, which has excellent heat cycle characteristics and in which Cu erosion and yellowish discoloration are suppressed, and an increase in viscosity of a solder paste over time is suppressed, a solder paste, a solder ball, a solder preform, a solder joint, and a circuit. The solder alloy has an alloy composition consisting of, by mass %, 2.8% to 4% of Ag, 1.5% to 6% of Bi, 0.8% to 1.2% of Cu, 0.0040% to 0.025% of As, and a balance of Sn.