The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2022

Filed:

Nov. 02, 2017
Applicant:

Shengyi Technology Co., Ltd., Guangdong, CN;

Inventors:

Minshe Su, Dongguan, CN;

Zhongqiang Yang, Dongguan, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 71/12 (2006.01); B32B 15/08 (2006.01); B32B 27/28 (2006.01); C08G 79/04 (2006.01); C08J 5/24 (2006.01); C08K 5/5313 (2006.01); C08L 43/02 (2006.01); C08J 5/04 (2006.01);
U.S. Cl.
CPC ...
C08L 71/126 (2013.01); B32B 15/08 (2013.01); B32B 27/285 (2013.01); C08G 79/04 (2013.01); C08J 5/24 (2013.01); C08K 5/5313 (2013.01); C08L 43/02 (2013.01); B32B 2260/046 (2013.01); B32B 2457/08 (2013.01); C08J 5/043 (2013.01); C08J 2371/12 (2013.01); C08L 2201/02 (2013.01); C08L 2203/20 (2013.01);
Abstract

Disclosed are a thermosetting resin composition, a prepreg made therefrom, a laminate clad with a metal foil, and a high-frequency circuit board, wherein the thermosetting resin composition contains thermosetting ingredients. The thermosetting ingredients include a phosphorus-containing monomer or a phosphorus-containing resin and a polyphenylene ether resin containing an unsaturated group, and the phosphorus-containing monomer or the phosphorus-containing resin has a structure as shown in formula I. By using the phosphorus-containing monomer or the phosphorus-containing resin as a cross-linking agent of the polyphenylene ether resin containing an unsaturated group and by means of a cross-linking reaction of a large number of unsaturated double bonds in the resin, the high-frequency dielectric properties and high-temperature-resistance required by a circuit substrate are provided.


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