The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2022

Filed:

Aug. 07, 2019
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

You-Hua Chou, Hsinchu, TW;

Kuo-Sheng Chuang, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B25J 11/00 (2006.01); H01L 21/687 (2006.01); H01L 21/677 (2006.01); B25J 15/00 (2006.01);
U.S. Cl.
CPC ...
B25J 11/0095 (2013.01); B25J 15/0014 (2013.01); H01L 21/67766 (2013.01); H01L 21/6875 (2013.01); H01L 21/68707 (2013.01); H01L 21/68742 (2013.01); H01L 21/68757 (2013.01);
Abstract

A method of aligning a substrate contact material to a substrate material includes determining a hardness of a substrate material. The method further includes matching a hardness of a substrate contact material to the hardness of the substrate material. The method further includes adding the substrate contact material to a plurality of contact structures of a substrate handling device, wherein the substrate handling device comprises an edge and a planar surface, a first contact structure of the plurality of contact structures extends from the edge, and a second contact structure of the plurality of contact structures extends from the planar surface.


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