The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2022

Filed:

Jun. 14, 2019
Applicant:

Ebara Corporation, Tokyo, JP;

Inventor:

Akira Nakamura, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/013 (2012.01); B24B 49/10 (2006.01); B24B 7/22 (2006.01); B24B 49/02 (2006.01); B24B 49/05 (2006.01); G01B 7/06 (2006.01); B24B 37/04 (2012.01);
U.S. Cl.
CPC ...
B24B 37/013 (2013.01); B24B 7/22 (2013.01); B24B 7/228 (2013.01); B24B 37/042 (2013.01); B24B 49/02 (2013.01); B24B 49/05 (2013.01); B24B 49/105 (2013.01); G01B 7/10 (2013.01);
Abstract

To specify a trajectory of an eddy current sensor provided on a polishing table of a substrate polishing apparatus, disclosed is a method of identifying a trajectory of an eddy current sensor as seen from a substrate in a substrate polishing apparatus having a polishing table and a polishing head. The method includes: obtaining a sensor output map as three-dimensional data; polishing the substrate; obtaining a profile of the real-time polishing signal as two-dimensional data; and extracting a trajectory having a profile most similar to the profile of the real-time polishing signal as two-dimensional data from the sensor output map as three-dimensional data and identifying the extracted trajectory as a trajectory of the eddy current sensor as seen from the substrate.


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