The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2022

Filed:

Jul. 23, 2020
Applicant:

Realtek Semiconductor Corporation, Hsinchu, TW;

Inventors:

Hsin-Chan Hsieh, New Taipei, TW;

Ruey-Beei Wu, Taipei, TW;

Shih-Hung Wang, Hsinchu, TW;

Ting-Ying Wu, Hsinchu County, TW;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2006.01); H01P 1/20 (2006.01); H01P 3/123 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0236 (2013.01); H01P 1/2005 (2013.01); H01P 3/123 (2013.01); H05K 1/181 (2013.01);
Abstract

An electromagnetic band gap structure apparatus includes a first conducting layer having at least one first slot. Each of the at least one slot is arranged with a planar conductor unit, and the each planar conductor unit is coupled to a first via. The electromagnetic band gap structure apparatus further includes a second conducting layer in parallel with the first conducting layer. The second conducting layer has a second slot. The second slot is arranged with at least one planar transmission line unit. The each of the at least one planar transmission line unit is coupled to the first conducting layer through a second via, and the each first via is coupled to the second conducting layer.


Find Patent Forward Citations

Loading…