The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2022

Filed:

Feb. 25, 2019
Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Ming-Han Wang, Kaohsiung, TW;

Ian Hu, Kaohsiung, TW;

Meng-Kai Shih, Kaohsiung, TW;

Hsuan Yu Chen, Kaohsiung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/232 (2006.01); H04N 5/247 (2006.01); G06T 7/00 (2017.01); H04N 5/225 (2006.01);
U.S. Cl.
CPC ...
H04N 5/23299 (2018.08); G06T 7/0004 (2013.01); H04N 5/2253 (2013.01); H04N 5/247 (2013.01); G06T 2207/30164 (2013.01);
Abstract

An optical measurement equipment includes an adjustment apparatus and at least two image capturing devices. The image capturing devices have a depth-of-field and attached to the adjustment apparatus. The image capturing devices are adjusted by the adjustment apparatus such that a portion to be measured of a workpiece is located within the depth-of-field of the image capturing devices.


Find Patent Forward Citations

Wang, Ming-Han. (2022). Optical measurement equipment and method for measuring warpage of a workpiece (U.S. Patent No. 11375124). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11375124

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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