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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11374135 B1

PDFFull Text
Date of Patent:
Jun. 28, 2022

Filed:

Aug. 30, 2019

Sensor and method of forming the same

Applicant:

Globalfoundries Singapore Pte. Ltd., Singapore, SG;

Inventors:

Lanxiang Wang, Singapore, SG;

Shyue Seng Tan, Singapore, SG;

Eng Huat Toh, Singapore, SG;

Assignee:

GLOBALFOUNDRIES Singapore Pte. Ltd., Singapore, SG;

Attorney:

Viering Jentschura & Partner mbB

Primary Examiner:

Julio J Maldonado

Assistant Examiner:

Stanetta D Isaac

Int. Cl.
CPC ...
H01L 31/02 (2006.01); H01L 31/028 (2006.01); H01L 31/18 (2006.01); H01L 31/0392 (2006.01); H01L 31/107 (2006.01); H01L 31/0312 (2006.01);
U.S. Cl.
CPC ...
H01L 31/02027 (2013.01); H01L 31/028 (2013.01); H01L 31/0312 (2013.01); H01L 31/03921 (2013.01); H01L 31/107 (2013.01); H01L 31/1804 (2013.01);
Abstract

A sensor may be provided, including a substrate having a first semiconductor layer, a second semiconductor layer, and a buried insulator layer arranged between the first semiconductor layer and the second semiconductor layer. The sensor may further include a photodiode arranged in the first semiconductor layer; and a quenching resistive element electrically connected in series with the photodiode. The quenching resistive element is arranged in the second semiconductor layer, and the quenching resistive element is arranged over the photodiode but separated from the photodiode by the buried insulator layer.

Find Patent Forward Citations

Wang, Lanxiang. (2022). Sensor and method of forming the same (U.S. Patent No. 11374135). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11374135

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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