The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2022

Filed:

Aug. 19, 2020
Applicant:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Inventors:

Katsuhisa Tanaka, Himeji Hyogo, JP;

Ryosuke Iijima, Setagaya Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 29/16 (2006.01); H01L 29/06 (2006.01); H01L 29/10 (2006.01); H01L 29/66 (2006.01); H01L 21/761 (2006.01); H01L 21/04 (2006.01); H02P 27/06 (2006.01); B66B 11/04 (2006.01); B60L 50/51 (2019.01); B61C 3/00 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7811 (2013.01); H01L 21/049 (2013.01); H01L 21/0465 (2013.01); H01L 21/761 (2013.01); H01L 29/0623 (2013.01); H01L 29/1095 (2013.01); H01L 29/1608 (2013.01); H01L 29/66068 (2013.01); H01L 29/7813 (2013.01); B60L 50/51 (2019.02); B60L 2210/42 (2013.01); B61C 3/00 (2013.01); B66B 11/043 (2013.01); H02P 27/06 (2013.01);
Abstract

A semiconductor device of an embodiment includes an element region and a termination region surrounding the element region. The element region includes a gate trench, a first silicon carbide region of n-type, a second silicon carbide region of p-type on the first silicon carbide region, a third silicon carbide region of n-type on the second silicon carbide region, and a fourth silicon carbide region of p-type sandwiches the first silicon carbide region and the second silicon carbide region with the gate trench, the fourth silicon carbide region being deeper than the gate trench. The termination region includes a first trench surrounding the element region, and a fifth silicon carbide region of p-type between the first trench and the first silicon carbide region, the fifth silicon carbide region same or shallower than the fourth silicon carbide region. The semiconductor device includes a gate electrode, a first electrode, and a second electrode.


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