The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2022
Filed:
Jan. 20, 2021
Applicant:
Shinko Electric Industries Co., Ltd., Nagano, JP;
Inventor:
Wataru Katayama, Nagano, JP;
Assignee:
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/48 (2006.01); H01L 21/00 (2006.01); H01L 23/00 (2006.01); H01L 23/049 (2006.01); H01L 23/045 (2006.01); H01L 23/055 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 23/045 (2013.01); H01L 23/049 (2013.01); H01L 23/055 (2013.01); H01L 23/49503 (2013.01); H01L 23/49558 (2013.01); H01L 23/49568 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 24/49 (2013.01);
Abstract
A stem for a semiconductor package, includes a plate, a frame, positioned on an outer periphery of the plate in a plan view, and bonded to the plate, and a lead terminal held in a state insulated from the plate and the frame. The plate protrudes from a top surface and a bottom surface of the frame, and a protruding amount of the plate from the top surface and a protruding amount of the plate from the bottom surface are the same.