The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2022

Filed:

Feb. 03, 2020
Applicant:

Xilinx, Inc., San Jose, CA (US);

Inventors:

Gamal Refai-Ahmed, Santa Clara, CA (US);

Chi-Yi Chao, New Taipei, TW;

Suresh Ramalingam, Fremont, CA (US);

Hoa Lap Do, San Jose, CA (US);

Anthony Torza, Oakland, CA (US);

Brian Philofsky, Longmont, CO (US);

Arun Kumar Varadarajan Rajagopal, San Jose, CA (US);

Assignee:

XILINX, INC., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/473 (2006.01); H01L 23/467 (2006.01); H01L 23/538 (2006.01); H01L 25/10 (2006.01); H01L 23/00 (2006.01); H01L 23/427 (2006.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); H01L 23/467 (2013.01); H01L 23/5385 (2013.01); H01L 24/32 (2013.01); H01L 25/105 (2013.01); H01L 23/427 (2013.01); H01L 24/16 (2013.01); H01L 24/73 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73253 (2013.01);
Abstract

A cooling plate assembly and electronic device having the same are provided which utilize active and passive cooling devices for improved thermal management of one or more chip package assemblies included in the electronic device. In one example, a cooling plate assembly is provided that includes a cooling plate having a first surface and an opposing second surface, a first active cooling device coupled to the first surface of the cooling plate, and a first passive cooling device coupled to the second surface of the cooling plate.


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