The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2022
Filed:
Dec. 05, 2019
Disco Corporation, Tokyo, JP;
Satoshi Kumazawa, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
A method of manufacturing a device chip includes applying, from a front surface of a wafer formed with devices in a plurality of regions partitioned by a plurality of crossing division lines, a laser beam of such a wavelength as to be absorbed in the wafer along the division lines, to form V-shaped laser processed grooves along the division lines, the laser processed grooves becoming shallower toward outer sides in a width direction; adhering an adhesive tape to the front surface of the wafer formed with the laser processed grooves; and grinding the wafer held by a chuck table, with the adhesive tape interposed therebetween, from a back surface, to divide the wafer while thinning the wafer to a finished thickness, thereby forming a plurality of device chips having inclined surfaces at outside surfaces thereof.