The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2022

Filed:

Jul. 24, 2020
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Joseph Abel, West Linn, OR (US);

Adrien Lavoie, Newberg, OR (US);

Purushottam Kumar, Hillsboro, OR (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 16/02 (2006.01); C23C 16/34 (2006.01); C23C 16/455 (2006.01); H01L 21/02 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02274 (2013.01); C23C 16/0245 (2013.01); C23C 16/345 (2013.01); C23C 16/4554 (2013.01); C23C 16/45565 (2013.01); H01J 37/3244 (2013.01); H01J 37/32082 (2013.01);
Abstract

Method for gap fill includes performing in order the following: (a) performing, consecutively, a first plurality of cycles of an atomic layer deposition process on a substrate; (b) purging process gases from the atomic layer deposition process; (c) performing a first plasma treatment on the substrate by introducing a fluorine plasma in the process chamber; (d) purging process gases from the plasma treatment; (e) repeating, in order, operations (a) through (d) until a predefined plurality of cycles has been performed; (f) performing, consecutively, a second plurality of cycles of the atomic layer deposition process on the substrate; (g) purging process gases from the atomic layer deposition process; (h) performing a second plasma treatment on the substrate by introducing a fluorine plasma in the process chamber; (i) purging process gases from the plasma treatment; (j) repeating, in order, operations (f) through (i) until a predefined plurality of cycles has been performed.


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