The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2022

Filed:

Sep. 17, 2019
Applicant:

HI Llc, Los Angeles, CA (US);

Inventors:

Sukanta Bhattacharyya, Belmont, CA (US);

Daniel Sobek, Portola Valley, CA (US);

Assignee:

HI LLC, Los Angeles, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C09J 5/06 (2006.01); C09J 185/00 (2006.01); C09J 183/16 (2006.01); G01R 33/12 (2006.01); A61B 5/245 (2021.01); C07F 7/08 (2006.01);
U.S. Cl.
CPC ...
C09J 5/06 (2013.01); A61B 5/245 (2021.01); C07F 7/081 (2013.01); C09J 183/16 (2013.01); C09J 185/00 (2013.01); G01R 33/1284 (2013.01); C09J 2400/126 (2013.01); C09J 2400/146 (2013.01); C09J 2483/00 (2013.01);
Abstract

A method for bonding together two substrates includes providing a molecular glue including glue molecules, each of the glue molecules having at least two —O—Si or —O—Al moieties; reacting a surface of a first substrate with the molecular glue to attach the glue molecules to the surface of the first substrate by at least one of the —O—Si or —O—Al moieties; and reacting a surface of a second substrate with the molecular glue to attach the glue molecules to the surface of the second substrate by at least another one of the —O—Si or —O—Al moieties. The method can be used for a variety of applications including manufacturing a vapor cell.


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