The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 2022

Filed:

Jul. 24, 2020
Applicant:

Ibiden Co., Ltd., Ogaki, JP;

Inventor:

Hirotaka Taniguchi, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 35/32 (2006.01); H01L 35/10 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 35/32 (2013.01); H01L 35/10 (2013.01); H05K 1/0209 (2013.01);
Abstract

A printed wiring board includes a core substrate including core material and having opening, thermoelectric elements including P-type and N-type thermoelectric elements such that the thermoelectric elements are accommodated in the opening, a first build-up layer including a first resin insulating layer on first surface of the core substrate and an outermost first resin insulating layer on the first resin insulating layer, and a second build-up layer including a second resin insulating layer on second surface of the core substrate and an outermost second resin insulating layer on the second resin insulating layer. The outermost first resin insulating layer is formed to have thermal conductivity that is higher than thermal conductivities of the first resin insulating layer and the core material, and the outermost second resin insulating layer is formed to have thermal conductivity that is higher than thermal conductivities of the second resin insulating layer and the core material.


Find Patent Forward Citations

Taniguchi, Hirotaka. (2022). Printed wiring board (U.S. Patent No. 11367825). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11367825

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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