The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 2022

Filed:

Jan. 08, 2020
Applicant:

Wolfspeed, Inc., Durham, NC (US);

Inventors:

Simon Ward, Morgan Hill, CA (US);

Richard Wilson, Morgan Hill, CA (US);

Alexander Komposch, Morgan Hill, CA (US);

Assignee:

Wolfspeed, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H03F 1/56 (2006.01); H01L 23/00 (2006.01); H05K 1/02 (2006.01); H03F 3/195 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 24/45 (2013.01); H03F 1/565 (2013.01); H03F 3/195 (2013.01); H05K 1/0243 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6655 (2013.01); H01L 2223/6672 (2013.01);
Abstract

RF amplifiers are provided that include a submount such as a thermally conductive flange. A dielectric substrate is mounted on an upper surface of the submount, the dielectric substrate having a first outer sidewall, a second outer sidewall that is opposite and substantially parallel to the first outer sidewall, and an interior opening. An RF amplifier die is mounted on the submount within the interior opening of the dielectric substrate, where a longitudinal axis of the RF amplifier die defines a first axis. The RF amplifier die is positioned so that a first angle defined by the intersection of the first axis with the first outer sidewall is between 5° and 45°. The dielectric substrate may be a ceramic substrate or a dielectric layer of a printed circuit board.


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