The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 2022

Filed:

Mar. 16, 2018
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Mitsuhiro Tomikawa, Tokyo, JP;

Kazuhiro Yoshikawa, Tokyo, JP;

Koichi Tsunoda, Tokyo, JP;

Kenichi Yoshida, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H05K 1/16 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4857 (2013.01); H05K 1/16 (2013.01); H05K 1/18 (2013.01); H05K 1/181 (2013.01); H05K 1/185 (2013.01); H05K 3/4015 (2013.01); H05K 3/4682 (2013.01);
Abstract

A first insulating layer, a conductor layer included on a first main surface, an electronic component included on the first main surface and a second insulating layer stacked on the first insulating layer are included, a stacking direction of the first insulating layer and the second insulating layer is the same as a stacking direction of a first electrode layer, a second electrode layer, and the dielectric layer in the electronic component, and a height position of a main surface of the electronic component on an opposite side from a side of the first main surface is different from a height position of a main surface of the conductor layer adjacent to the electronic component on an opposite side from a side of the first main surface in the stacking direction.


Find Patent Forward Citations

Loading…