The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2022
Filed:
Jan. 14, 2021
Cadence Design Systems, Inc., San Jose, CA (US);
Mitchell G. Poplack, San Jose, CA (US);
Tarik Hanai Omar, Truckee, CA (US);
TheHung Luu, Santa Clara, CA (US);
Zaid Khan, San Jose, CA (US);
Jerome Albert, Sunnyvale, CA (US);
CADENCE DESIGN SYSTEMS, INC., San Jose, CA (US);
Abstract
Methods and systems herein can efficiently interconnect processors through a custom grid (a data mesh) utilizing upper metal layer routing in a semiconductor die design to minimize latency. A computer-implemented method of routing interconnects on a semiconductor die includes receiving a set of non-default routes and associated routing rules; identifying a set of critical signals for feedthrough on the set of non-default routes; generating a connectivity matrix including a set of resulting routes, the resulting routes routing the set of critical signals through the set of non-default routes; generating a timing analysis of the connectivity matrix based on a set of latency requirements; responsive to determining that the timing analysis is not compliant with the latency requirements, generating a set of routing constraints; and updating the associated routing rules to include the set of routing constraints.