The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2022
Filed:
Oct. 30, 2018
Applicant:
Merck Patent Gmbh, Darmstadt, DE;
Inventors:
Shigemasa Nakasugi, Yamato, JP;
Hiroshi Yanagita, Kakegawa, JP;
Takashi Sekito, Kakegawa, JP;
Yusuke Hama, Kakegawa, JP;
Yuriko Matsuura, Kakegawa, JP;
Assignee:
MERCK PATENT GMBH, Darmstadt, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/11 (2006.01); C08G 61/02 (2006.01); C07C 43/215 (2006.01); C09D 149/00 (2006.01); H01L 21/027 (2006.01); H01L 21/311 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
G03F 7/11 (2013.01); C07C 43/215 (2013.01); C08G 61/02 (2013.01); C09D 149/00 (2013.01); H01L 21/0274 (2013.01); H01L 21/31111 (2013.01); H01L 21/31144 (2013.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); C07C 2601/14 (2017.05); C07C 2603/18 (2017.05); C07C 2603/24 (2017.05); C08G 2261/124 (2013.01); C08G 2261/148 (2013.01); C08G 2261/1424 (2013.01); C08G 2261/226 (2013.01); C08G 2261/228 (2013.01); C08G 2261/312 (2013.01); C08G 2261/3142 (2013.01);
Abstract
The present invention provides a resist underlayer forming composition, which is well in heat resistance and gap filling. Further, the present invention provides methods of manufacturing a resist underlayer and semiconductor device using it. [Means for Solution] A composition comprising a allyloxy derivative having a specific group and a solvent, and methods of manufacturing a resist underlayer and semiconductor device using it.