The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2022
Filed:
Jul. 10, 2020
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Adib M. Khan, Santa Clara, CA (US);
Qiwei Liang, Fremont, CA (US);
Sultan Malik, Sacramento, CA (US);
Srinivas D. Nemani, Sunnyvale, CA (US);
Assignee:
APPLIED MATERIALS, INC., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/447 (2006.01); C23C 16/452 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/447 (2013.01); C23C 16/452 (2013.01); H01L 21/67011 (2013.01);
Abstract
The present disclosure relates to high pressure processing apparatus for semiconductor processing. The apparatus described herein include a high pressure process chamber and a containment chamber surrounding the process chamber. A high pressure fluid delivery module is in fluid communication with the high pressure process chamber and is configured to deliver a high pressure fluid to the process chamber.