The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2022

Filed:

Nov. 09, 2020
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Ryutaro Suda, Miyagi, JP;

Maju Tomura, Miyagi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3213 (2006.01); H01L 21/308 (2006.01); H01L 21/02 (2006.01); H01J 37/32 (2006.01); C23C 16/52 (2006.01); C23C 16/40 (2006.01); H01L 21/3065 (2006.01); H01L 21/311 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/32137 (2013.01); C23C 16/401 (2013.01); C23C 16/52 (2013.01); H01J 37/32091 (2013.01); H01J 37/32449 (2013.01); H01J 37/32724 (2013.01); H01J 37/32862 (2013.01); H01L 21/02164 (2013.01); H01L 21/308 (2013.01); H01L 21/3065 (2013.01); H01L 21/31116 (2013.01); H01L 21/31144 (2013.01); H01L 21/32139 (2013.01); H01L 21/67069 (2013.01); H01L 21/6831 (2013.01); H01J 2237/2007 (2013.01); H01J 2237/334 (2013.01);
Abstract

A technique improves selectivity in etching of a silicon-containing film over etching of a mask in plasma etching. A substrate processing method includes placing a substrate in a chamber in a plasma processing apparatus. The substrate includes a silicon-containing film and a mask on the silicon-containing film. The substrate processing method further includes generating plasma from a first process gas containing a hydrogen fluoride gas in the chamber. The generating plasma includes etching the silicon-containing film with a chemical species contained in the plasma. A flow rate of the hydrogen fluoride gas is at least 25 vol % of a total flow rate of the non-inert components of the first process gas.


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