The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2022

Filed:

Sep. 11, 2019
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Nadine L. Dabby, Palo Alto, CA (US);

Sasha N. Oster, Chandler, AZ (US);

Aleksandar Aleksov, Chandler, AZ (US);

Braxton Lathrop, Lake Oswego, OR (US);

Racquel L Fygenson, Goleta, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); G06F 1/16 (2006.01); H05K 3/34 (2006.01); H05K 3/32 (2006.01); H05K 1/03 (2006.01); H05K 1/02 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
G06F 1/163 (2013.01); G06F 1/1656 (2013.01); H05K 1/0283 (2013.01); H05K 1/038 (2013.01); H05K 3/321 (2013.01); H05K 3/3463 (2013.01); H05K 3/284 (2013.01); H05K 2201/0314 (2013.01); H05K 2203/1311 (2013.01); H05K 2203/1383 (2013.01);
Abstract

Systems and methods describe herein provide a solution to the technical problem of creating a wearable electronic devices. In particular, these systems and methods enable electrical and mechanical attachment of stretchable or flexible electronics to fabric. A stretchable or flexible electronic platform is bonded to fabric using a double-sided fabric adhesive, and conductive adhesive is used to join pads on the electronic platform to corresponding electrical leads on the fabric. An additional waterproofing material may be used over and beneath the electronic platform to provide a water-resistant or waterproof device This stretchable or flexible electronic platform integration process allows the platform to bend and move with the fabric while protecting the conductive connections. By using flexible and stretchable conductive leads and adhesives, the platform is more flexible and stretchable than traditional rigid electronics enclosures.


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