The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2022
Filed:
Sep. 08, 2017
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Yuta Momiuchi, Kanagawa, JP;
Yuji Takaoka, Kanagawa, JP;
Hirokazu Nakayama, Kanagawa, JP;
Kiyohisa Tanaka, Kanagawa, JP;
Miyoshi Togawa, Oita, JP;
Hirokazu Seki, Oita, JP;
SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa, JP;
Abstract
The present technology relates to a camera module, a production method, and an electronic device that can prevent reduction of optical module positioning accuracy or heat dissipation performance. An image pickup element is joined on one face of a flexible board so that a light receiving surface of the image pickup element is exposed through an opening of the flexible board, and an optical module is joined on an other face of the flexible board. A reinforcing member is joined on the one face of the flexible board at a circumference of the image pickup element and reinforces a joining part of the flexible board where the optical module is joined. The reinforcing member is joined so as to face an area including at least a part of the joining part and is formed so that a part of the circumference of the image pickup element is kept open.