The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2022

Filed:

Mar. 15, 2019
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Miki Ouchi, Iwate, JP;

Yuichi Fukuchi, Iwate, JP;

Masahiro Miya, Iwate, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H04L 67/01 (2022.01); G05B 19/4155 (2006.01); H04L 67/06 (2022.01);
U.S. Cl.
CPC ...
H04L 67/42 (2013.01); G05B 19/4155 (2013.01); H01L 21/02 (2013.01); H04L 67/06 (2013.01); G05B 2219/45031 (2013.01);
Abstract

A semiconductor manufacturing system according to an embodiment includes: a controller configured to control a semiconductor manufacturing apparatus; and a server configured to bidirectionally communicate with the controller via a communication line. The server includes a first processor configured to: transmit a backup file creation request (signal) that sets data specific to each controller as a backup file and transmit a backup file acquisition request (signal) requesting acquisition of the created backup file; and receive the created backup file. The controller includes a second processor configured to: receive a request (signal) from the server; and create the backup file when receiving the backup file creation request (signal).


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