The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2022

Filed:

Mar. 07, 2017
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Katsutoshi Sugawara, Tokyo, JP;

Yutaka Fukui, Tokyo, JP;

Kohei Adachi, Tokyo, JP;

Hideyuki Hatta, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 29/06 (2006.01); H01L 29/417 (2006.01); H01L 29/739 (2006.01); H01L 29/66 (2006.01); H01L 29/423 (2006.01); H01L 29/12 (2006.01); H02M 7/5387 (2007.01); H01L 29/16 (2006.01); H01L 29/20 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7813 (2013.01); H01L 29/06 (2013.01); H01L 29/0615 (2013.01); H01L 29/0619 (2013.01); H01L 29/0623 (2013.01); H01L 29/0696 (2013.01); H01L 29/12 (2013.01); H01L 29/41741 (2013.01); H01L 29/4238 (2013.01); H01L 29/66348 (2013.01); H01L 29/66734 (2013.01); H01L 29/739 (2013.01); H01L 29/7397 (2013.01); H01L 29/78 (2013.01); H01L 29/7811 (2013.01); H01L 29/1608 (2013.01); H01L 29/2003 (2013.01); H02M 7/53871 (2013.01);
Abstract

A silicon carbide semiconductor device includes a diffusion protective layer provided below a gate insulating film, a gate line provided on an insulation film on the bottom face of a terminal trench and electrically connected to a gate electrode, the terminal trench being located more toward the outer side than the gate trench, a gate pad joined to the gate line in the terminal trench, a terminal protective layer provided below the insulation film on the bottom face of the terminal trench, and a source electrode electrically connected to a source region, the diffusion protective layer, and the terminal protective layer. The diffusion protective layer has first extensions that extend toward the terminal protective layer and that are separated from the terminal protective layer. This configuration inhibits an excessive electric field from being applied to the gate insulating film provided on the bottom face of the gate trench.


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