The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2022

Filed:

Jun. 06, 2019
Applicant:

Cyntec Co., Ltd., Hsinchu, TW;

Inventors:

Tsung-Chan Wu, Hsinchu County, TW;

Roger Hsieh, Hsinchu County, TW;

Yi-Min Huang, Hsinchu, TW;

Lan-Chin Hsieh, Kaohsiung, TW;

Yu-Ching Kuo, Miaoli County, TW;

Assignee:

CYNTEC CO., LTD., Hsinchu, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 27/255 (2006.01); H01F 17/04 (2006.01); H01F 41/12 (2006.01);
U.S. Cl.
CPC ...
H01F 27/255 (2013.01); H01F 17/045 (2013.01); H01F 41/127 (2013.01); H01F 2017/048 (2013.01);
Abstract

An electronic device including a core, at least a wire and a magnetic material is provided. The core includes a pillar, a top board and a bottom board. The pillar is disposed between the top board and the bottom board. A winding space is formed among the top board, the bottom board and the pillar. The wire is wound around the pillar and located in the winding space. The magnetic material fills the winding space to encapsulate the wire. The magnetic material includes a resin and a magnetic powder, wherein an average particle diameter of the magnetic powder is smaller than 20 μm.


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