The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2022

Filed:

Jan. 09, 2018
Applicant:

Cyntec Co., Ltd., Hsinchu, TW;

Inventors:

Yung-Cheng Chang, Hsinchu County, TW;

Chih-Siang Chuang, Hsinchu, TW;

Yi-Min Huang, Hsinchu, TW;

Assignee:

CYNTEC CO., LTD, Hsinchu, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/02 (2006.01); H01F 5/04 (2006.01); H01F 3/10 (2006.01); H01F 17/04 (2006.01); H01F 27/29 (2006.01);
U.S. Cl.
CPC ...
H01F 5/04 (2013.01); H01F 3/10 (2013.01); H01F 17/04 (2013.01); H01F 27/292 (2013.01);
Abstract

An electronic component comprising: a body; a conductive wire in the body; and a first lead comprising a first part disposed on a first surface of the body and a second part disposed on a second surface of the body, wherein the second part of the first lead comprises a first protrusion portion and a second protrusion portion spaced apart from each other, wherein a first portion of a first terminal part of the conductive wire is disposed between the first protrusion portion and the second part of the first lead disposed on the second surface of the body, and a second portion of the first terminal part of the conductive wire is disposed between the second protrusion portion and the second part of the first lead disposed on the second surface of the body.


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