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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11352523 B1

PDFFull Text
Date of Patent:
Jun. 07, 2022

Filed:

Mar. 20, 2019

Polishing liquid, polishing liquid set and polishing method

Applicant:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Inventors:

Tomohiro Iwano, Tokyo, JP;

Takaaki Matsumoto, Tokyo, JP;

Tomomi Kukita, Tokyo, JP;

Tomoyasu Hasegawa, Tokyo, JP;

Assignee:

SHOWA DENKO MATERIALS CO., LTD., Tokyo, JP;

Attorney:

Fitch, Even, Tabin & Flannery, L.L.P.

Primary Examiner:

Jiong-Ping Lu

Int. Cl.
CPC ...
C09G 1/02 (2006.01); H01L 21/304 (2006.01); H01L 21/3105 (2006.01); B24B 37/04 (2012.01); C09K 13/06 (2006.01); B24B 1/00 (2006.01); C09G 1/06 (2006.01); H01L 21/306 (2006.01); C09K 3/14 (2006.01); C09G 1/04 (2006.01); C09G 1/00 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); B24B 1/00 (2013.01); B24B 37/044 (2013.01); C09G 1/00 (2013.01); C09G 1/04 (2013.01); C09G 1/06 (2013.01); C09K 3/14 (2013.01); C09K 3/1454 (2013.01); C09K 3/1463 (2013.01); C09K 13/06 (2013.01); H01L 21/304 (2013.01); H01L 21/30625 (2013.01); H01L 21/31053 (2013.01); H01L 21/31055 (2013.01); H01L 21/3212 (2013.01);
Abstract

According to an aspect of the present invention, there is provided a polishing liquid containing abrasive grains, a hydroxy acid, a polyol, at least one zwitterionic compound selected from the group consisting of an aminocarboxylic acid and an aminosulfonic acid, and a liquid medium, in which a zeta potential of the abrasive grains is positive, an isoelectric point of the aminocarboxylic acid is smaller than 7.0, and pKa of the aminosulfonic acid is larger than 0.

Find Patent Forward Citations

Iwano, Tomohiro. (2022). Polishing liquid, polishing liquid set and polishing method (U.S. Patent No. 11352523). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11352523

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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