The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2022

Filed:

Mar. 01, 2019
Applicant:

Mitsubishi Materials Corporation, Tokyo, JP;

Inventors:

Jun Kato, Saitama, JP;

Yuki Ito, Saitama, JP;

Hiroyuki Matsukawa, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 9/10 (2006.01); B33Y 70/00 (2020.01); B22F 1/05 (2022.01);
U.S. Cl.
CPC ...
B22F 1/05 (2022.01); B33Y 70/00 (2014.12); C22C 9/10 (2013.01); B22F 2301/10 (2013.01);
Abstract

This copper alloy powder having an excellent laser absorptivity includes: either one or both of B and S in an amount of 0.003 mass % to 5.0 mass %, with a remainder being Cu and inevitable impurities, wherein an average particle diameter is 20 μm to 80 μm. This copper alloy powder having an excellent laser absorptivity is preferably a powder for metal additive manufacturing.


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